This acid copper plating solution is specifically developed for electroplating onto low conductivity surfaces in direct metallisation systems.
It uses a single additive specially formulated for the plating of DMS coated holes in which the initiation of the ductile copper layer is of prime importance to the hole profile.
Compared with other standard copper processes, it gives much faster coverage of low conductivity surfaces and improves metal distribution in the hole.
The SLOTOCOUP CU120 process is also suitable for conventional electroless copper coated boards giving bright, fine grained and very ductile deposits.
Developed for the filling of blind vias in either pattern or panel plating mode, SLOTOCOUP BV110 has exceptional levelling and filling capability.
The process can be used with either conventional copper or inert mixed oxide anodes.
The brilliant deposit displays good ductility with low internal stress, also providing reliable though-hole plating.
In regular production, blind vias of 120/80µm and smaller are easily filled.
SLOTOCOUP CU110 is designed to optimise the benefits obtainable from periodic reverse pulse plating in the volume production of complex plated through-hole PCBs.
Maintained with a single multi-component additive and operating in conjunction with pulse plating, the process can significantly reduce plating times with improved throwing power.
Excellent surface metal distribution ratios and fine grain, very ductile deposits are provided. It can also be used for conventional DC plating.
This purified liquid concentrate provides trouble-free manufacture and maintenance of all copper sulphate plating solutions.
Developed for use in copper sulphate plating solutions. Schloetter can supply copper anodes as bars, copper slugs or copper balls.
MMO coated titanium anodes are designed to resist acidic conditions. The coating, which has excellent electro-catalytic properties, allows current flow and evolution of oxygen at low, stable anode potentials.
The MMO coating is a mixed metal oxide type, which includes precious metal oxides based on Iridium. The typical coating weight is 20 g/m³.
Used for the replenishment of copper in acid copper solutions using inert anode technology.