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Schloetter UK
01386 552331

Final Finishes

PCB Final Finishes:

Immersion Tin SN 30-1

A replenishable immersion tin plating solution for the deposition of a solderable coating of tin onto copper.

The tin deposit provides good solderability retention, even after extended storage periods. It can also be used to clean and brighten oxidised lead or tin-lead electroplate.

ENIG (Electroless Nickel – Immersion Gold)

The Umicore ENIG process is a market leader, widely accepted for its ease of use and stability as a process, and for the reliability of the ENIG finish, facilitating excellent quality solder and wire bonding assembly.

The process comprises:

Cleaner Concentrate 865

Innovative, extremely effective, low temperature cleaner designed to be non-detrimental to Solder-Mask. Contains no complexing Agents. No etch on copper contributing to a long solution life.

Micro-Etch 910

Low maintenance, giving an even satin finish

Activator MNK-4

Chloride free, easy to control single component process, gives excellent, even and consistent Palladium coverage on copper, not on the dielectric.

Electroless Nickel NPR-8v2

Extremely stable and predictable process. Very even Nickel deposit with excellent integrity and even Phosphorous content across the panel, and through the life of the bath.  Designed to conform with complex surface features without ‘nickel foot’.

Immersion Gold GOBRIGHT TLA-77

With low gold concentration (0.4g/L optimum), consistent and even gold thickness on both ground plane areas and fine-pitch devices, the TLA-77 is an extremely cost effective process. Formulated to give optimum performance at low gold concentration to eliminate problems with Nickel Corrosion Spikes.

ENEPIG (Electroless Nickel – Electroless Palladium - Immersion Gold)

The well proven Umicore ENEPIG process is designed so that each process step complements the next, resulting in an integrated process to produce a consistent, high quality Universal Finish, excellent for Gold Wire Bonding and multifunctional assembly applications. 

The process comprises:

Cleaner Concentrate 865

Innovative, extremely effective, low temperature cleaner designed to be non-detrimental to Solder-Mask. Contains no complexing Agents. No etch on copper contributing to a long solution life.

Micro-Etch 910

Low maintenance, giving an even satin finish

Activator MNK-4

Chloride free, easy to control single component process, gives excellent, even and consistent Palladium coverage on copper, not on the dielectric.

Electroless Nickel NPR-8v2

Extremely stable and predictable process. Very even Nickel deposit with excellent integrity and even Phosphorous content across the panel, and through the life of the bath.  Designed to conform with complex surface features without ‘nickel foot’.

Electroless Palladium XTP (MW)

A neutral, stable process which is easy to operate, giving a controllable thickness of Palladium Phosphorous alloy over the nickel surface.  The deposit is ideally suited for accepting a subsequent immersion gold deposit.

Immersion Gold TCL-61

Excellent and even coverage of gold regardless of surface feature design. Long solution life, easy to maintain and control.

Memberships and Accreditations:

       

Contact Numbers:
Telephone +44(0)1386 552331
   
Address:

Schloetter Co Ltd
Abbey Works
New Road
Pershore
Worcestershire, UK
WR10 1BY