Schloetter UK
01386 552331

Lead plating processes

Lead Plating Processes used in the PCB Industry:

Matt Lead MSN 10-1

MSN 10-1 is a fluoride-free plating process for the deposition of matt fine-grained lead coatings.

In PCB applications, it can be used as an etch resist and in the company’s SLOTOTON process it is used at a thickness of 0.5 - 2 µm prior to tin-lead deposition providing improvements in solderability of PTH circuits.

Lead Ancillaries:

Lead Concentrate FP

A liquid lead methane sulphonate concentrate containing 20% (w/w) lead.

Acid Concentrate FF

A purified methyl sulphonic acid concentrate

Lead Anodes

Lead anodes may be supplied as bars or slugs dependent upon customer requirements


Memberships and Accreditations:


Contact Numbers:
Telephone +44(0)1386 552331

Schloetter Co Ltd
Abbey Works
New Road
Worcestershire, UK
WR10 1BY