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Tin Alloy & Lead Processes

Tin-Lead Alloy Processes:

Matt Tin-Lead SLOTOLET K 10 - 1

This is a fluoride-free single additive process for the deposition of matt fine grained coatings containing from 5-95% lead.  The level of co-deposited carbon is very low resulting in excellent solderability even after extended storage times or stringent ageing tests.  With exceptional throwing power and alloy consistency, the electrolyte is ideally suited for plating complex PCBs and electronic components.

Bright Tin-Lead SLOTOLET G40 - 1

The SLOTOLET G40 - 1 bright tin-lead rack and barrel solution is a fluoride and formaldehyde free process for the deposition of bright coatings containing up to 40% lead. The deposits are tarnish and corrosion resistant and give excellent solderability even after heat ageing at 155oC for 16 hours.

Slotolet G40 - 1 gives a bright deposit, with consistent alloy over a wide current density range, making the process ideal for both processing electronic and electrical components.

Bright Tin-Lead SLOTOLET G50 - 1

SLOTOLET G50 - 1 is a strongly acidic, fluoride-free electrolyte developed for the deposition of bright tin-lead coatings on electronic components. 

The alloy composition can be varied over a wide range and for the deposition of mirror-bright tin coatings, the electrolyte can be made up without lead. This allows the process to produce pure tin deposits through to alloys containing 35% lead

The process is suitable for vat and barrel applications.

Matt Tin-Lead SLOTOLET KB10

SLOTOLET KB10 is a fluoride-free process for the deposition of matt fine-grained coatings containing up to 40% lead.  The deposit has excellent solderability even after extended storage periods due to the very low level of co-deposited carbon.

The process is specifically designed for high-speed wire, strip and spot plating machines.  A low foaming additive system promotes excellent alloy consistency and distribution.  Cathodic current densities of up to 80A/dm2 can be achieved.  It can also be adjusted for low temperature or low metal operation with a supplementary additive.

Tin-Lead SLOTOLET KB30

SLOTOLET KB30 is an acidic fluoride-free electrolyte which produces matt fine grained tin-lead deposits. This electrolyte has been formulated specifically for high-speed tin-lead applications such as reel-to-reel plating of connector pins, IC lead frames or wire plating.

Tin-Lead SLOTOLET KB40

SLOTOLET KB40 is an acidic fluoride-free electrolyte which produces semi-bright tin-lead deposits. This electrolyte has been formulated specifically for high-speed tin-lead applications such as reel-to-reel plating of connector pins, IC lead frames or wire plating.

Tin-Lead LA

A fluoborate based matt tin lead process for deposition of fine grained coatings up to 40% lead.
The deposit exhibits excellent reflow characteristics and solderability even after long storage periods.

Bright Tin-Lead SLOTOLET GB40

Containing 10-40% lead, GB40 is a fluoride and formaldehyde-free process for the deposition of bright coatings in high-speed reel-to-reel applications. 

With a cathode efficiency of 80% it is particularly suitable for the plating of fully immersed plain strip.  Deposits are tarnish and corrosion resistance and give excellent solderability even after heat ageing at 155o C for 16 hours.

Bright Tin-Lead SLOTOLET GB 60

SLOTOLET GB60 produces deposits of bright tin-lead containing 5-40% lead. It is suitable for use in high speed applications such as reel-to-reel and has a wide operating current density range.

The bath may be operated at temperatures of up to 35-40oC, which means that there is no need to cool the electrolyte.

Lead-Free Processes:

Tin-Bismuth SLOTOLOY SNB 10

SLOTOLOY SNB10 is a tin-bismuth electrolyte for depositing alloys of up to 30% bismuth. The silky, dull deposits are suitable for all rack and barrel ‘lead-free’ electronic applications.

Tin-Bismuth Slotoloy SNB 20

A high speed electrolyte for the deposition of tin-bismuth containing up to 10% bismuth.

The silky, dull deposits have excellent ‘lead-free’ solderability, making this process ideal for electronic applications.

Tin-Bismuth Slotoloy SNB 30 1

SLOTOLOY SNB10 is a tin-bismuth electrolyte for depositing alloys of up to 5% bismuth. The silky, dull deposits are suitable for ‘lead-free’ electronic applications.

Tin-Copper SLOTOLOY SNC 10

SLOTOLOY SNC10 is a very stable tin-copper alloy rack plating bath for ‘lead-free’ plating of all types of electronic components.

The deposits contain 1-10% copper with very little co-deposited organics.

Tin-Copper SLOTOLOY SNC 20

A tin-copper alloy plating electrolyte, SLOTOLOY SNC20 produces a fine crystalline, matt deposit containing between 1 and 10% copper.

This bath is suitable for all types of electronic components in high speed plating applications.

Tin-Silver SLOTOLOY SNA 30

A strong acidic electrolyte for the deposition of matt fine-crystalline tin-silver with a silver co-deposition of approx. 3%. 

As the additives are low foaming this process may be used in reel-to-reel, jet, rack or barrel applications.

Pure Tin SLOTOTIN 40

A high speed tin electrolyte to produce a fine crystalline deposit of 3-8μm in size. The deposit demonstrates a resistance to the formation of whiskers making it and ideal ‘lead-free’ finish for the electronics industry.

Tin Alloy Ancillaries:

Tin Concentrates FS, FS20, FS200 and FS220

As a manufacturer of tin MSA, Schloetter are able to supply a number of concentrations of high quality tin methane sulphate.

Lead Concentrate FP

A liquid lead methane sulphonate concentrate containing 20% (W/W) lead.

Acid Concentrate FF

A purified methyl sulphonic acid concentrate

Neutraliser PT10

This is a weakly alkaline product for the post treatment of tin and tin-lead plated components.  It is made up using a liquid concentrate.

It is effective at removing processing residues from the surfaces of plated components, thereby enhancing long term solderability performance.

Anti Foam SN

Developed for use in tin or tin-lead baths where foaming results from strong turbulence.

Tin Anodes

Tin anodes may be supplied as bars, slugs or ball shapes dependent upon customer requirement.

Tin-Lead Anodes 

Tin-Lead anodes may be supplied as bars, slugs or ball shapes dependent upon customer requirement.

Lead Processes:

Matt Lead MSN 10 - 1

For use in PCB and general plating applications, MSN 10 - 1 is a fluoride-free process for the deposition of matt fine-grained coatings

With MSN 10 - 1 matt lead it is possible to plate smooth, dendrite-free coatings in excess of 200 µm, making the process suited to the plating of battery components.

Lead Concentrate FP

A liquid lead methane sulphonate concentrate containing 20% (W/W) lead.

Acid Concentrate FF

A purified methyl sulphonic acid concentrate

Lead Anodes

Lead anodes may be supplied as bars, slugs or ball shapes dependent upon customer requirement.

Tin Alloy Stripping Processes:

Stripper PLUTEX

An alkaline,cyanide-free process for the stripping  of tin and tin-lead deposits from steel and copper components.  This stripper does not remove the diffusion layer, ensuring that the base material is not attacked.

PLUTEX has a stripping rate 10-12 m per minute and a metal capacity of 50-60 grams per ltr of tin or 60-70 grams per ltr of tin-lead.

Stripper L30

Two different versions of Stripper L30 can be made up.

The first version L30/1 is used for the immersion stripping of tin and tin-lead deposits from copper. 

The second L30/2 is used for the stripping of tin, tin-lead and copper deposits from stainless steel jigs and contacts.

Memberships and Accreditations:

       

Contact Numbers:
Telephone +44(0)1386 552331
   
Address:

Schloetter Co Ltd
Abbey Works
New Road
Pershore
Worcestershire, UK
WR10 1BY