Schloetter UK
01386 552331

Tin-Lead plating processes

Tin-Lead Plating Processes used in the PCB Industry:

Matt Tin-Lead LA

Established for many years in the printed circuit industry, tin-lead LA is a fluoborate based plating process producing uniform matt fine-grained deposits containing up to 40% lead.

Deposits have excellent reflow properties and solderability even after long storage periods.

Matt Tin-Lead SLOTOLET K 10-1

This is a fluoride-free single additive process for the deposition of matt fine grained coatings containing from 5 - 95% lead.

The level of co-deposited carbon is very low resulting in excellent solderability even after extended storage times or stringent ageing tests.

With exceptional throwing power and alloy consistency, the electrolyte is ideally suited for plating complex PCBs and electronic components.

Tin-Lead Ancillaries:

Tin Coagulant FMN

A coagulant designed to aid the precipitation of stannic tin compounds in tin and tin-lead solutions assisting solution clarification.

Tin Concentrate TINCON B200

A liquid tin fluoborate concentrate containing 20% (w/w) tin

Lead Concentrate B270

A liquid lead fluoborate concentrate containing 27% (w/w) lead

Acid Concentrate PB500

50% (w/w) fluoboric acid

Tin Concentrates FS, FS20 & FS200

As a manufacturer of tin MSA, Schloetter are able to supply a number of concentrations of high quality tin methane sulphonate

Acid Concentrate FF

A purified methyl sulphonic acid concentrate

Anti Foam SN

Developed for use in tin or tin-lead baths where foaming results from high turbulence

Tin Anodes

Tin anodes may be supplied as bars, slugs or ball shapes dependent upon customer requirements.



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Contact Numbers:
Telephone +44(0)1386 552331

Schloetter Co Ltd
Abbey Works
New Road
Worcestershire, UK
WR10 1BY