Used for the pre-plating of steel, zinc-based diecastings, aluminium, lead or its alloys, the cyanide copper strike is a hydroxide-free electrolyte.
It gives a fine grained, matt to semi-bright deposit up to a maximum thickness of 5 µm.
This cyanide based copper electrolyte produces bright, smooth and ductile deposits.
The throwing and covering power are excellent; the process is very suitable for the plating of profiled parts.
As it is hydroxide free, it is particularly suitable for the copper plating of zinc-based diecastings. It is suitable for both rack and barrel applications.
A decorative acid copper process giving a mirror bright, highly levelled deposit. Levelling performance is maintained even at low current densities. This sulphuric acid based electrolyte has a stable additive system and wide operating parameters.
Operating temperature of the bath is 20-30oC (25oC) optimum and the current density varies between 1 and 6A/dm2.
Deposition rate is 0.88 µm/minute at 4A/dm2.
A key factor in the success of SLOTOCOUP PC81 acid copper has been its suitability for the deposition of thick and very ductile deposits.
Other advantages include its ability to withstand the most demanding thermal cycle tests and to operate over a wide range of current densities.
Using a single additive system, which produces no detrimental breakdown products, the bath remains stable after being left idle for long periods. Deposition rate is approximately 0.88 µm/minute at 4 amps/dm².
This acid copper has been specifically developed for use with direct metallisation systems where initiation of the copper layer is of prime importance to the PCB hole profile.
It can also be used on traditional electroless copper coated boards giving a fine grained and ductile deposit.
This process has been specifically developed for use with periodic reverse pulse plating.
The process produces a fine grained ductile deposit with excellent distribution characteristics which can significantly shorten plating times.
An acid copper electrolyte which is used for the production of HDI boards in order to fill blind vias.
The deposit is very bright with excellent throwing power and metal distribution.
This acid copper electrolyte produces a very bright deposit with excellent levelling.
The process is controlled with a single additive making it very easy to control.
The plated deposit has a high deposition rate, very low internal stress and is soft which makes polishing very easy.
This pure, anti-caking additive free, salt is available for the trouble free manufacture and maintenance of all copper sulphate plating solutions.
This purified liquid concentrate provides trouble free manufacture and maintenance of all copper sulphate plating solutions.
A high purity cupric oxide with low chloride content for use in via fill electrolytes using MMO anodes
A 32% w/w pure concentrate of copper methane sulphonate.
A high grade 50% concentrate of copper fluoborate.
Developed for use in cyanide solutions
Developed for use with copper sulphate plating solutions.
Pure sulphuric acid, suitable for the maintenance of copper, nickel and a variety of processes.
Stripper L is an alkaline cyanide based process for the stripping of a variety of metals from steel.
This process is capable of effective stripping of nickel, electroless nickel, copper, cadmium, zinc and tin.
The base metal is not attacked so subsequent replating is possible without the need for further finishing.
Two different versions of Stripper L30 can be made up.
The first version L30/1 is used for the immersion stripping of tin and tin-lead deposits from copper.
The second L30/2 is used for the stripping of tin, tin-lead and copper deposits from stainless steel jigs and contacts.